Qualcomm Hyping Previously Announced Chips That Fit Apple S Mobile Needs
UPDATE: Qualcomm at Mobile World Congress in Barcelona, Spain took the wraps off three next-generation modem chipsets, first to support 84MBps HSPA+ Release 10 and LTE-Advanced with carrier aggregation technology. Chipmaker Qualcomm today issued a press release highlighting a fifth iteration of its Gobi reference platform that had actually been introduced back in February 2011. That said, these chips include in a comprehensive support for TD-SCDMA, TD-LTE, LTE on FDD and TDD networks worldwide, in addition to embedded GPS capability....